Capabilities

Capabilities2025-09-08T16:25:26+00:00

Ampel Inc. is a full service PCB manufacturer providing leading edge printed circuit board technology and innovative, profitable value-added services.With extensive experience and ISO certification, we offer a complete menu of PCB capabilities, including stock and custom work.Our headquarters is located in a modern 35,000 sq. ft. manufacturing facility, located in Elk Grove Village, Illinois near Chicago’s O’Hare International Airport.

CAPABILITIES

Ampel’s manufacturing team has experience with a large number of board types and technologies, as well as standard single sided through multilayer product. Whenever you have a special requirement or need a unusual board type, give us a call, we pride ourselves on our customer support.
Special Capabilities2025-04-25T19:46:36+00:00
  • Fine lines and SMT pitch
  • Board thickness 0.008 to 0.250
  • Carbon Ink Contacts
  • Oversized multilayer boards
  • Ball Grid Array (BGA) patterns
  • Blind and buried vias
  • Peelable/Water soluble masks
  • Plated slots and edges
  • Epoxy via plug
  • Blind Buried Vias
  • Control Impedance
Board Type2025-04-25T19:46:42+00:00
  • CEM 1 and CEM3
  • Polyimide
  • Cyanate Ester
  • Multifunctional Epoxy
  • PTFE (Teflon)
  • Flex, Getek and Rigid-Flex
  • High Temperature FR-4, FR-406, FR-408 & FR-5
  • Low Dk, Low Df, High Tg
  • Aluminium clad
  • Rogers 3010, 4000, 5880, 6200
  • Halogen Free boards
Surface Finishes2025-04-25T19:46:48+00:00
  • HASL (Hot Air Leveled Solder)
  • Lead Free Solder
  • ENIG (Electroless Nickel Immersion Gold)
  • Hard Gold
  • Immersion Silver
  • Immersion nickel
  • Solder Mask Over Bare Copper (SMOBC)
  • Selective Hard Gold
  • OSP (Organic Solderability Preservatives)
  • White Tin (Immersion Tin)
Engineering Services2025-04-25T19:46:55+00:00
  • Integrated CAM and photo plotting
  • Array Design/Panelization
  • Design For Manufacturability (DFM
Testing2025-04-25T19:46:30+00:00
  • Precision Gold and Copper thickness measurement
  • Complete micro section system
  • Ionic Contamination
  • 100% Node and Netlist Testing
  • Clam Shell electrical testing
  • Flying grid electrical testing
  • SMT fixtures build in-house
  • Certified test results
  • Statistical Process Control (SPC)
  • AOI system for inner and outer layers
Processing2025-04-25T19:46:21+00:00
  • Largest panel size -18 x 30
  • Maximum number of layers -14
  • Minimum circuit width -.005
  • Smallest finished hole -.008
  • Maximum finished copper -7 oz
  • PTH tolerance -+/- .003
  • Routed feature tolerance -+/- .005
  • Solder mask opening allowance
  • Wet mask -.010 per side
  • LPI – .0025 per side
  • Annular ring PTH hole +/- .005
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