Company Details
DATE ESTABLISHED: 1983
Turn Times Available:
24 hours on 1 to 6 layer
48 hours on 8 to 10 layers
72 hours on 12 to 14 layers
Above 14 layers call us
“Quick Turn Prototypes Through Production”
Our headquarters is located in a modern 35,000 sq. ft. manufacturing facility, located in Elk Grove Village, Illinois near Chicago’s O’Hare International Airport.
Ampel Inc.,was established in 1983, as a quick turn prototype shop servicing the Chicago’s electronic manufacturing companies printed circuit board needs with a commitment to quality, reliable service and customer satisfaction.
We now service customers nationwide offering rapid prototyping service through production deliverers of all types of Printed Circuit Boards from single side to multi-layer up to 16 layers.
Ampel Inc. is a full service PCB manufacturer providing leading edge printed circuit board technology and innovative, profitable value-added services.
With extensive experience and ISO certification, we offer a complete menu of PCB capabilities, including stock and custom work.
- We are UL 94V-0 approved and build to IPC-A-600 Standards
- Electrical Testing
- Flying Grid, single sided Clam Shell and Net List testing
- Cross Section analysis
- Ionic Contamination
- Single and Double sided
- Multilayers through 14 layers
- Flex and rigid flex
- Teflon, Duriod and Getek
- Aluminium Led Boards
- 24 hours on 1 to 6 layer
- 48 hours on 8 to 10 layers
- 72 hours on 12 to 14 layers
- Above 14 layers call us
- Plant Size: 35,200 sq. ft.
- Date Established: 1983
- Largest panel size -18 x 30
- Maximum number of layers -14
- Minimum circuit width -.005
- Smallest finished hole -.008
- Maximum finished copper -7 oz
- PTH tolerance -+/- .003
- Routed feature tolerance -+/- .005
- Solder mask opening allowance
- Wet mask -.010 per side
- LPI – .0025 per side
- Annular ring PTH hole +/- .005
- Precision Gold and Copper thickness measurement
- Complete micro section system
- Ionic Contamination
- 100% Node and Netlist Testing
- Clam Shell electrical testing
- Flying grid electrical testing
- SMT fixtures build in-house
- Certified test results
- Statistical Process Control (SPC)
- AOI system for inner and outer layers
- Fine lines and SMT pitch
- Board thickness 0.008 to 0.250
- Carbon Ink Contacts
- Oversized multilayer boards
- Ball Grid Array (BGA) patterns
- Blind and buried vias
- Peelable/Water soluble masks
- Plated slots and edges
- Epoxy via plug
- Blind Buried Vias
- Control Impedance
- CEM 1 and CEM3
- Polyimide
- Cyanate Ester
- Multifunctional Epoxy
- PTFE (Teflon)
- Flex, Getek and Rigid-Flex
- High Temperature FR-4, FR-406, FR-408 & FR-5
- Low Dk, Low Df, High Tg
- Aluminium clad
- Rogers 3010, 4000, 5880, 6200
- Halogen Free boards
- HASL (Hot Air Leveled Solder)
- Lead Free Solder
- ENIG (Electroless Nickel Immersion Gold)
- Hard Gold
- Immersion Silver
- Immersion nickel
- Solder Mask Over Bare Copper (SMOBC)
- Selective Hard Gold
- OSP (Organic Solderability Preservatives)
- White Tin (Immersion Tin)
- Integrated CAM and photo plotting
- Array Design/Panelization
- Design For Manufacturability (DFM
